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- ICPF Strengthens Existing University Outreach Programs and Initiatives
ICPF Strengthens Existing University Outreach Programs and Initiatives
July 3, 2024

University Awards Program – Asset Donations
Through ICPF’s University Awards Program, 10 universities submitted requests for 2024 funding that included equipment for packaging design and graphic media printing, state-of-the-art research materials, and resources to grow packaging coursework. The ICPF board approved five proposals, and ICPF is in the process of fulfilling those awards at Bowling Green State University, University of Wisconsin–Stout (UW–Stout), Rutgers University, Virginia Tech, and Michigan State University. ICPF also worked to place board-approved Zünd cutting tables at Cal Poly and Clemson University for coursework, student projects, and to enable participation in many packaging competitions. The donations allow expanded knowledge and increased exposure for students pursuing various degrees, helping ICPF’s mission to grow the corrugated packaging industry labor force.
Sponsorships – Software Donations, Pack Jam, and Phoenix Challenge Competition
ICPF was a platinum sponsor of this year’s Pack Jam, an annual student-led conference connecting packaging students with industry professionals, held April 7–9, 2024. Students from packaging universities and colleges in the U.S. and Canada connected with industry professionals and alumni to showcase the impact that packaging has on the world. ICPF has also partnered with Arden Software to sponsor and donate design software to the University of Northern Iowa and Pittsburg State University. Additionally, ICPF sponsored and supported the Phoenix Challenge High School and College Competitions. Students from colleges and universities across the U.S. and Canada showcased their research, problem-solving, design, and print production skills at the Flexo Xperience Center in Atlanta.Visiting Schools – Indiana State, UW–Stout, Cal Poly, Clemson
ICPF has visited packaging schools across the U.S. to promote the foundation and industry career opportunities. In November 2023, ICPF visited Indiana State University and UW–Stout. In February, ICPF President Caitlin Salaverria spoke to 150 students and professionals at Cal Poly’s Packaging Symposium. The foundation will visit Clemson University in September 2024 to speak to its packaging club, meet program educators, and perform a ribbon-cutting ceremony on the newly donated equipment. Visit www.careersincorrugated.com for more information on the work ICPF is doing. There, you can also learn more about how you can get involved and connect with ICPF.
